A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives.