Invention Grant
- Patent Title: Wired circuit board and production method thereof
- Patent Title (中): 有线电路板及其制作方法
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Application No.: US11783024Application Date: 2007-04-05
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Publication No.: US07782571B2Publication Date: 2010-08-24
- Inventor: Jun Ishii , Yasunari Ooyabu
- Applicant: Jun Ishii , Yasunari Ooyabu
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Akerman Senterfitt
- Agent Jean C. Edwards, Esq.
- Priority: JP2006-104446 20060405; JP2007-004559 20070112
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semi-conductive layer formed on the conductive pattern, an insulating cover layer formed on the first semi-conductive layer, and a second semi-conductive layer formed on the insulating cover layer. The first semi-conductive layer and the second semi-conductive layer are electrically connected to the metal supporting board.
Public/Granted literature
- US20070235219A1 Wired circuit board and production method thereof Public/Granted day:2007-10-11
Information query
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