An electronic device enclosure includes a metallic body and a metallic speaker-receiving member. The metallic body includes a first side, a second side, and a crossbeam connecting the first side and the second side. A first connecting portion extends from the second side and parallel to the crossbeam. A distal portion of the first side define a first connecting plane. The first connecting portion defines a first connecting surface. The metallic speaker-receiving member includes a first sidewall and a second sidewall. The first sidewall defines a second connecting portion. A second connecting plane is defined by a bent distal end of the second sidewall. The second connecting plane is welded to the first connecting plane, and the second connecting portion is welded to the first connecting portion to securely attach the metallic speaker-receiving member to the metallic body. Such a configuration allows miniaturization of the electronic device enclosure.