Invention Grant
- Patent Title: IC chip parameter modeling
- Patent Title (中): IC芯片参数建模
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Application No.: US11742620Application Date: 2007-05-01
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Publication No.: US07783466B2Publication Date: 2010-08-24
- Inventor: John R. Jones , Steven G. Lovejoy , Henry W. Trombley , Josef S. Watts
- Applicant: John R. Jones , Steven G. Lovejoy , Henry W. Trombley , Josef S. Watts
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Ryan K. Simmons
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method and system are disclosed for preserving measured temperature and geometric behavior of a hardware model while adjusting the model to match specified target values. In one embodiment, the method includes measuring a characteristic of an integrated circuit (IC) chip at a plurality of temperatures; modeling to form a hardware model for the characteristic versus temperature based on the measuring; obtaining a known first target value of the characteristic for at least one temperature in the hardware model; determining a plurality of second target values for the characteristic for a corresponding plurality of temperatures in the hardware model; and modeling to form a target model for the characteristic based on the first known target value and the plurality of second target values.
Public/Granted literature
- US20080275675A1 IC CHIP PARAMETER MODELING Public/Granted day:2008-11-06
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