Invention Grant
US07783813B2 Multi-node configuration of processor cards connected via processor fabrics
失效
通过处理器接口连接的处理器卡的多节点配置
- Patent Title: Multi-node configuration of processor cards connected via processor fabrics
- Patent Title (中): 通过处理器接口连接的处理器卡的多节点配置
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Application No.: US11763411Application Date: 2007-06-14
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Publication No.: US07783813B2Publication Date: 2010-08-24
- Inventor: William Garrett Verdoorn, Jr. , Andrew Dale Walls
- Applicant: William Garrett Verdoorn, Jr. , Andrew Dale Walls
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Konrad Raynes and Victor LLP
- Agent David W. Victor
- Main IPC: G06F9/00
- IPC: G06F9/00

Abstract:
Provided is a system comprising a first node comprising a plurality of processor cards each including a processor fabric, wherein the processor cards in the first node connect via their processor fabrics; a second node comprising a plurality of processor cards each including a processor fabric, wherein the processor cards in the second node connect via their processor fabrics; and a plurality of communication interfaces, wherein each interface connects one processor card in the second node to one processor card in the first node to enable communication between the connected processor cards to coordinate processor operations between the connected processor cards in the first and second nodes.
Public/Granted literature
- US20080313369A1 MULTI-NODE CONFIGURATION OF PROCESSOR CARDS CONNECTED VIA PROCESSOR FABRICS Public/Granted day:2008-12-18
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