Semiconductor device with dielectric structure and method for fabricating the same

Invention Grant

US07786521B2 Semiconductor device with dielectric structure and method for fabricating the same 失效

Title translation: 具有介电结构的半导体器件及其制造方法

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Patent Title: Semiconductor device with dielectric structure and method for fabricating the same
Patent Title (中): 具有介电结构的半导体器件及其制造方法
Application No.: US12359811

Application Date: 2009-01-26
Publication No.: US07786521B2

Publication Date: 2010-08-31
Inventor: Ki-Seon Park , Jae-Sung Roh
Applicant: Ki-Seon Park , Jae-Sung Roh
Applicant Address: KR Gyeonggi-do
Assignee: Hynix Semiconductor Inc.
Current Assignee: Hynix Semiconductor Inc.
Current Assignee Address: KR Gyeonggi-do
Agency: IP & T Law Firm PLC
Priority: KR10-2005-0080246 20050830
Main IPC: H01L21/8234
IPC: H01L21/8234 ; H01L27/94 ; H01L27/108 ; H01L27/76

Semiconductor device with dielectric structure and method for fabricating the same

Abstract:

A semiconductor device with a dielectric structure and a method for fabricating the same are provided. A capacitor in the semiconductor device includes: a bottom electrode formed on a substrate; a first dielectric layer made of titanium dioxide (TiO2) in rutile phase and formed on the bottom electrode; and an upper electrode formed on the first dielectric layer.

Abstract(Chinese):

提供具有介电结构的半导体器件及其制造方法。半导体器件中的电容器包括：形成在基板上的底部电极; 由金红石相中的二氧化钛（TiO 2）形成的第一电介质层，并形成在底部电极上; 以及形成在所述第一介电层上的上电极。

Public/Granted literature

US20090134445A1 SEMICONDUCTOR DEVICE WITH DIELECTRIC STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-05-28

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺