Invention Grant
- Patent Title: Image sensor and method for manufacturing the same
- Patent Title (中): 图像传感器及其制造方法
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Application No.: US12534291Application Date: 2009-08-03
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Publication No.: US07786545B2Publication Date: 2010-08-31
- Inventor: Seoung Hyun Kim
- Applicant: Seoung Hyun Kim
- Applicant Address: KR Seoul
- Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee: Dongbu Hitek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Saliwanchik
- Priority: KR10-2007-0023307 20070309
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes a substrate provided with a transistor circuit, first and second interconnections separated from each other on the substrate, a first conductive-type conductive layer formed at side surfaces of the first interconnection, a second conductive-type conductive layer formed at side surfaces of the second interconnection, and an intrinsic layer formed between the first and second conductive-type conductive layers thereby forming a P-I-N structure.
Public/Granted literature
- US20090283849A1 IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-11-19
Information query
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