Invention Grant
US07786547B2 Formation of active area using semiconductor growth process without STI integration
有权
使用半导体生长过程形成活性区,无需STI整合
- Patent Title: Formation of active area using semiconductor growth process without STI integration
- Patent Title (中): 使用半导体生长过程形成活性区,无需STI整合
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Application No.: US11657825Application Date: 2007-01-25
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Publication No.: US07786547B2Publication Date: 2010-08-31
- Inventor: Jiang Yan , Danny Pak-Chum Shum
- Applicant: Jiang Yan , Danny Pak-Chum Shum
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor device can be formed without use of an STI process. An insulating layer is formed over a semiconductor body. Portions of the insulating layer are removed to expose the semiconductor body, e.g., to expose bare silicon. A semiconductor material, e.g., silicon, is grown over the exposed semiconductor body. A device, such as a transistor, can then be formed in the grown semiconductor material.
Public/Granted literature
- US20070122985A1 Formation of active area using semiconductor growth process without STI integration Public/Granted day:2007-05-31
Information query
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