Invention Grant
US07786578B2 Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure
失效
使用非晶Ni合金硅化物结构消除富含金属的硅化物
- Patent Title: Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure
- Patent Title (中): 使用非晶Ni合金硅化物结构消除富含金属的硅化物
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Application No.: US12105037Application Date: 2008-04-17
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Publication No.: US07786578B2Publication Date: 2010-08-31
- Inventor: Christophe Detavenier , Simon Gaudet , Christian Lavoie , Conal E. Murray
- Applicant: Christophe Detavenier , Simon Gaudet , Christian Lavoie , Conal E. Murray
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40

Abstract:
The present invention provides a method for producing thin nickel (Ni) monosilicide or NiSi films (having a thickness on the order of about 30 nm or less), as contacts in CMOS devices wherein an amorphous Ni alloy silicide layer is formed during annealing which eliminates (i.e., completely by-passing) the formation of metal-rich silicide layers. By eliminating the formation of the metal-rich silicide layers, the resultant NiSi film formed has improved surface roughness as compared to a NiSi film formed from a metal-rich silicide phase. The method of the present invention also forms Ni monosilicide films without experiencing any dependence of the dopant type concentration within the Si-containing substrate that exists with the prior art NiSi films.
Public/Granted literature
- US20080217781A1 ELIMINATING METAL-RICH SILICIDES USING AN AMORPHOUS Ni ALLOY SILICIDE STRUCTURE Public/Granted day:2008-09-11
Information query
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