Invention Grant
- Patent Title: Integrated circuit die with pedestal
- Patent Title (中): 带基座的集成电路管芯
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Application No.: US11760690Application Date: 2007-06-08
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Publication No.: US07786593B2Publication Date: 2010-08-31
- Inventor: Virgil Cotoco Ararao , Il Kwon Shim , Seng Guan Chow
- Applicant: Virgil Cotoco Ararao , Il Kwon Shim , Seng Guan Chow
- Applicant Address: SG Singapore
- Assignee: ST Assembly Test Services Ltd.
- Current Assignee: ST Assembly Test Services Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.
Public/Granted literature
- US20070228538A1 INTEGRATED CIRCUIT DIE WITH PEDESTAL Public/Granted day:2007-10-04
Information query
IPC分类:
