Invention Grant
- Patent Title: Multilayer type test board assembly for high-precision inspection
- Patent Title (中): 多层型测试板组件进行高精度检测
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Application No.: US12006543Application Date: 2008-01-03
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Publication No.: US07786721B2Publication Date: 2010-08-31
- Inventor: Min-Gu Kim , Young-Soo An , Ho-Jeong Choi , Jung-Hyeon Kim
- Applicant: Min-Gu Kim , Young-Soo An , Ho-Jeong Choi , Jung-Hyeon Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2007-0000933 20070104
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/26

Abstract:
There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.
Public/Granted literature
- US20080164901A1 Multilayer type test board assembly for high-precision inspection Public/Granted day:2008-07-10
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