Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US12453506Application Date: 2009-05-13
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Publication No.: US07787718B2Publication Date: 2010-08-31
- Inventor: Jun Ishii , Toshiki Naito
- Applicant: Jun Ishii , Toshiki Naito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Akerman Senterfitt
- Agent Jean C. Edwards, Esq.
- Priority: JP2008-127235 20080514
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/26 ; G02B6/30 ; G02B6/36 ; G02B6/10 ; G02B6/00
Abstract:
A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board.
Public/Granted literature
- US20090285524A1 Suspension board with circuit Public/Granted day:2009-11-19
Information query
