Invention Grant
- Patent Title: Lead anchoring assembly
- Patent Title (中): 导线组装
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Application No.: US11706702Application Date: 2007-02-15
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Publication No.: US07787960B2Publication Date: 2010-08-31
- Inventor: Timothy R. Lubenow , Kenny Kinyen Chinn , Christopher Ewan Gillespie , John M. Barker
- Applicant: Timothy R. Lubenow , Kenny Kinyen Chinn , Christopher Ewan Gillespie , John M. Barker
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Frommer Lawrence & Haug LLP
- Agent Bruce E. Black
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
An electrical lead anchoring assembly comprising a body comprising at least one recess and at least one channel there through for receiving at least one electrical lead, at least one arm pivotably coupled to the body and moveable between an open and a closed position wherein the arm is at least partially disposed within the recess such that the arm intrudes into the channel and frictionally abuts at least a portion of the length of electrical lead disposed in the channel to couple the lead to the body.
Public/Granted literature
- US20080196939A1 Lead anchoring assembly Public/Granted day:2008-08-21
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