Invention Grant
- Patent Title: Suspension assembly positioning method
- Patent Title (中): 悬架装配定位方法
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Application No.: US11515753Application Date: 2006-09-06
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Publication No.: US07788782B2Publication Date: 2010-09-07
- Inventor: Toshihisa Shimoda , Keiichiro Maekawa
- Applicant: Toshihisa Shimoda , Keiichiro Maekawa
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2005-261146 20050908
- Main IPC: B23Q17/00
- IPC: B23Q17/00 ; G06F17/50

Abstract:
A first reference position C1 constituting a middle point is calculated by measuring positions of left and right damper attaching holes 22 in a white body 12. A second reference position C2 constituting a middle point is calculated by measuring positions of left and right hubs 44 in a suspension assembly 20. A position of the suspension assembly 20 is adjusted by a slide table 56 such that the first reference position C1 and the second reference position C2 are coincident with each other. The suspension assembly 20 is moved up by a lift mechanism 59 and is attached to the white body 12.
Public/Granted literature
- US20070055484A1 Suspension assembly positioning method Public/Granted day:2007-03-08
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