Invention Grant
US07788961B2 System and method for ballizing and measuring a workpiece bore hole
有权
用于球磨和测量工件钻孔的系统和方法
- Patent Title: System and method for ballizing and measuring a workpiece bore hole
- Patent Title (中): 用于球磨和测量工件钻孔的系统和方法
-
Application No.: US12503574Application Date: 2009-07-15
-
Publication No.: US07788961B2Publication Date: 2010-09-07
- Inventor: Lev Mikhailovich Dvoskin , Gunter K. Heine , Roger A. Addy
- Applicant: Lev Mikhailovich Dvoskin , Gunter K. Heine , Edelgard Heine, legal representative , Roger A. Addy
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology, LLC
- Current Assignee: Seagate Technology, LLC
- Current Assignee Address: US CA Scotts Valley
- Main IPC: B21J7/12
- IPC: B21J7/12

Abstract:
A system and method are described for ballizing and measuring a workpiece bore hole. In one embodiment, a ballizing unit having a distal end removably coupled to a ballizing member moves the ballizing member from a first position within the bore hole to a second position. A metrology unit having a distal end removably coupled to the ballizing member moves the ballizing member from the second position back to the first position. A sensor detects a force exerted on the ballizing member by the workpiece at a third position, which is located between the first and second positions.
Public/Granted literature
- US20090293578A1 System And Method For Ballizing And Measuring A Workpiece Bore Hole Public/Granted day:2009-12-03
Information query
IPC分类: