Invention Grant
- Patent Title: Semiconductor acceleration sensor device and method for manufacturing the same
- Patent Title (中): 半导体加速度传感器装置及其制造方法
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Application No.: US12490411Application Date: 2009-06-24
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Publication No.: US07788976B2Publication Date: 2010-09-07
- Inventor: Yoshinori Shizuno
- Applicant: Yoshinori Shizuno
- Applicant Address: JP
- Assignee: OKI Semiconductor Co., Ltd.
- Current Assignee: OKI Semiconductor Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Donald R. Studebaker
- Priority: JP2004-181596 20040618
- Main IPC: G01P1/02
- IPC: G01P1/02 ; G01P15/12

Abstract:
Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.
Public/Granted literature
- US20090255340A1 SEMICONDUCTOR ACCELERATION SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-10-15
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