Invention Grant
US07788976B2 Semiconductor acceleration sensor device and method for manufacturing the same 失效
半导体加速度传感器装置及其制造方法

Semiconductor acceleration sensor device and method for manufacturing the same
Abstract:
Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.
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