Invention Grant
- Patent Title: Precision machining system and methods
- Patent Title (中): 精密加工系统及方法
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Application No.: US11374373Application Date: 2006-03-13
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Publication No.: US07788998B2Publication Date: 2010-09-07
- Inventor: Jon Ethington , Xinbing Liu
- Applicant: Jon Ethington , Xinbing Liu
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Main IPC: B23B5/36
- IPC: B23B5/36 ; B23B5/00

Abstract:
A precision machining system with a variable projected machining width of the cutting surface of the machining tool, including: a workpiece holder to hold a workpiece; a machining tool holder to hold the machining tool such that the Z axis is substantially parallel to the tool's centerline; a Z translation stage and an X translation stage each coupled to one of the workpiece holder or the machining tool holder; a workpiece spindle coupled to the workpiece holder to rotate the workpiece about the workpiece axis that is parallel to the Z axis; a machining path controller electrically coupled to the X translation stage and the workpiece spindle; and a tool spindle coupled to the machining tool holder. The tool spindle rotates the machining tool about the centerline of the machining tool, which varies the width of the cutting surface of the machining tool projected perpendicular to the machining path.
Public/Granted literature
- US20070221019A1 Precision machining system and methods Public/Granted day:2007-09-27
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