Invention Grant
- Patent Title: Frame structure for vertically mounting integrated package
- Patent Title (中): 用于垂直安装集成包装的框架结构
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Application No.: US12006193Application Date: 2007-12-31
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Publication No.: US07789454B2Publication Date: 2010-09-07
- Inventor: Dal Kim , Hae Kyu Lim
- Applicant: Dal Kim , Hae Kyu Lim
- Applicant Address: KR Seoul KR Seoul
- Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee Address: KR Seoul KR Seoul
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent Peter F. Corless
- Priority: KR10-2007-0115231 20071113
- Main IPC: B62D21/00
- IPC: B62D21/00
Abstract:
The present invention relates to a frame structure for vertically mounting an integrated package, which can improve mountability of the batteries and structural rigidity of the integrated package and a vehicle body. To this end, the present invention provides a frame structure which comprises: a rear floor frame disposed behind a rear seat of the vehicle in a transverse direction of body of the vehicle; and a pair of guide frames are installed in parallel with each other behind the rear floor frame in a longitudinal direction of the vehicle body.
Public/Granted literature
- US20090121510A1 Frame structure for vertically mounting integrated package Public/Granted day:2009-05-14
Information query
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