Invention Grant
- Patent Title: Packaging structure of inkjet head
- Patent Title (中): 喷墨头包装结构
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Application No.: US11580726Application Date: 2006-10-13
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Publication No.: US07789480B2Publication Date: 2010-09-07
- Inventor: Tatsuya Shindo
- Applicant: Tatsuya Shindo
- Applicant Address: JP Aichi-Ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Aichi-Ken
- Agency: Frommer Lawrence & Haug LLP
- Priority: JP2005-298919 20051013
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/175

Abstract:
A packaging structure of an inkjet head for transporting thereof with a liquid stored therein, the inkjet head including an ink inlet of ink supplied from an ink source and a nozzle communicated with the ink inlet for discharging the ink to a recording medium, comprises a first packaging member including a cap for covering an opening of said nozzle, the first packaging member being detachably attached to the opening of said nozzle, and a second packaging member including an ink absorbing material for covering said ink inlet, the second packaging member being detachably attached to said ink inlet.
Public/Granted literature
- US20070085884A1 Packaging structure of inkjet head Public/Granted day:2007-04-19
Information query
IPC分类: