Invention Grant
- Patent Title: Temperature sensor
- Patent Title (中): 温度感应器
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Application No.: US11700323Application Date: 2007-01-31
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Publication No.: US07789555B2Publication Date: 2010-09-07
- Inventor: Colin Harcourt , Stefan Thorsteinson
- Applicant: Colin Harcourt , Stefan Thorsteinson
- Agency: Davis & Bujold, P.L.L.C.
- Priority: CA2535499 20060131
- Main IPC: G01K1/00
- IPC: G01K1/00
Abstract:
A temperature sensor includes a heat conducting metallic contact pad having a contact surface. A sensor probe is embedded in the contact pad. Conductive wires extend through the contact pad and are connected to the sensor probe.
Public/Granted literature
- US20070175266A1 Temperature sensor Public/Granted day:2007-08-02
Information query
