Invention Grant
- Patent Title: Integrated optical interconnect
- Patent Title (中): 集成光互连
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Application No.: US12198778Application Date: 2008-08-26
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Publication No.: US07789571B2Publication Date: 2010-09-07
- Inventor: Tat Ming Teo
- Applicant: Tat Ming Teo
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Workman Nydegger
- Main IPC: G02B6/38
- IPC: G02B6/38 ; G02B6/36 ; B29D11/00

Abstract:
An integrated optical interconnect. The integrated optical interconnect includes a receptacle for connecting to a first external component. The receptacle includes an EMI shield with an aperture sized to allow transmission of an optical signal through the aperture while containing EMI within the receptacle. The integrated optical interconnect also includes a port injection molded around or within a portion of the receptacle, the port being configured to receive a second external component and a lens injection molded near a location of the aperture of the EMI shield.
Public/Granted literature
- US20090123118A1 INTEGRATED OPTICAL INTERCONNECT Public/Granted day:2009-05-14
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