It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.