Invention Grant
- Patent Title: Processing apparatus and method
- Patent Title (中): 处理装置和方法
-
Application No.: US11149046Application Date: 2005-06-08
-
Publication No.: US07789647B2Publication Date: 2010-09-07
- Inventor: Eigo Kawakami , Hirohisa Ota , Takashi Nakamura , Kazuyuki Kasumi , Toshinobu Tokita
- Applicant: Eigo Kawakami , Hirohisa Ota , Takashi Nakamura , Kazuyuki Kasumi , Toshinobu Tokita
- Applicant Address: JP
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2004-173317 20040611
- Main IPC: B28B17/00
- IPC: B28B17/00 ; B29C35/08 ; B29C59/00
Abstract:
A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, and an irradiation of light for exposing the resist onto the resist includes a mold chuck for holding the mold and for compressing the mold against the resist, and a deformation reducing part for reducing a deformation of the mold when the mold chuck applies a compression force to the mold.
Public/Granted literature
- US20050275125A1 Processing apparatus and method Public/Granted day:2005-12-15
Information query
IPC分类:
