Invention Grant
- Patent Title: Contact module for an electrical connector having propagation delay compensation
- Patent Title (中): 具有传播延迟补偿的电连接器的接触模块
-
Application No.: US12178336Application Date: 2008-07-23
-
Publication No.: US07789705B2Publication Date: 2010-09-07
- Inventor: Chad William Morgan
- Applicant: Chad William Morgan
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A contact module is provided for an electrical connector. The contact module includes a lead frame. The lead frame includes first and second differential pairs of terminals. Each of the terminals extends between a mating edge portion and a mounting edge portion. A first dielectric body surrounds at least a portion of the first differential pair of terminals. The first dielectric body includes a first dielectric constant. A second dielectric body surrounds at least a portion of the second differential pair of terminals. The second dielectric body includes a second dielectric constant that is different than the first dielectric constant of the first dielectric body.
Public/Granted literature
- US20100022129A1 CONTACT MODULE FOR AN ELECTRICAL CONNECTOR HAVING PROPAGATION DELAY COMPENSATION Public/Granted day:2010-01-28
Information query