Invention Grant
US07789713B2 Connector jack with reduced host PCB footprint, assembly thereof and fabrication method of the same
有权
连接器插座,主机PCB占用面积减小,组装及其制造方法
- Patent Title: Connector jack with reduced host PCB footprint, assembly thereof and fabrication method of the same
- Patent Title (中): 连接器插座,主机PCB占用面积减小,组装及其制造方法
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Application No.: US12144914Application Date: 2008-06-24
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Publication No.: US07789713B2Publication Date: 2010-09-07
- Inventor: Dmitry Slepov
- Applicant: Dmitry Slepov
- Applicant Address: TW Taipei
- Assignee: Tibbo Technology, Inc.
- Current Assignee: Tibbo Technology, Inc.
- Current Assignee Address: TW Taipei
- Agency: Morris, Manning & Martin LLP
- Agent Tim Tingkang Xia
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A connector jack with reduced host PCB footprint and an assembly of the same are provided. The provided connector jack is constructed based on a housing defining at least a front face with a plug receiving cavity on the surface thereof and with a plurality of electrical contacts positioned within the cavity, and a bottom face having a recess area on the surface thereof and adapted for mounting on a circuit board. In the present invention, at least a portion of the housing is made of a transparent or translucent material so that the status indicators located within the recess will be visible through the transparent portion of the front face of the jack housing, and the recess area occupies a substantial portion of the bottom face and allows to place additional components on the circuit board at least partially within the recess area.
Public/Granted literature
- US20090318015A1 CONNECTOR JACK WITH REDUCED HOST PCB FOOTPRINT, ASSEMBLY THEREOF AND FABRICATION METHOD OF THE SAME Public/Granted day:2009-12-24
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