Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US12336724Application Date: 2008-12-17
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Publication No.: US07789972B2Publication Date: 2010-09-07
- Inventor: Nobuo Edamoto
- Applicant: Nobuo Edamoto
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2004-250494 20040830
- Main IPC: B08B7/00
- IPC: B08B7/00 ; B04B7/08 ; B04B11/06

Abstract:
A substrate processing apparatus according to the present invention comprises a substrate holding mechanism for holding a substrate and rotating the held substrate; a process liquid supply mechanism for supplying a process liquid to the substrate; a process liquid acquisition section arranged so as to enclose the substrate holding mechanism and having an acquisition port for acquiring the process liquid scattered by the rotation of the substrate; a movement mechanism for changing a relative position between the process liquid acquisition section and the substrate held by the substrate holding mechanism; and a control mechanism for controlling, when the process liquid scattered by the rotation of the substrate is acquired in the acquisition port, a relative position between the substrate and the acquisition port such that the scattered process liquid is acquired in the acquisition port on the basis of predetermined substrate process condition.
Public/Granted literature
- US20090090391A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2009-04-09
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