Invention Grant
- Patent Title: Rolled copper foil and manufacturing method thereof
- Patent Title (中): 轧制铜箔及其制造方法
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Application No.: US11682943Application Date: 2007-03-07
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Publication No.: US07789977B2Publication Date: 2010-09-07
- Inventor: Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
- Applicant: Takemi Muroga , Yasuyuki Ito , Koji Aoyagi , Yoshiki Yamamoto , Kenji Yokomizo , Katsumi Nomura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-290880 20061026; JP2006-290884 20061026
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22F1/08

Abstract:
A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}Cu plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.
Public/Granted literature
- US20080099110A1 ROLLED COPPER FOIL AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-05-01
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