A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.