Invention Grant
- Patent Title: Method for magnetron sputter deposition
- Patent Title (中): 磁控溅射沉积方法
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Application No.: US11397878Application Date: 2006-04-04
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Publication No.: US07790003B2Publication Date: 2010-09-07
- Inventor: Kuang-Tsan Kenneth Chiang , Ronghua Wei , Edward Langa
- Applicant: Kuang-Tsan Kenneth Chiang , Ronghua Wei , Edward Langa
- Applicant Address: US TX San Antonio
- Assignee: Southwest Research Institute
- Current Assignee: Southwest Research Institute
- Current Assignee Address: US TX San Antonio
- Agency: Grossman Tucker et al.
- Main IPC: C23C14/35
- IPC: C23C14/35

Abstract:
A method for depositing a nanostructured coating comprising chromium or a copper-chromium mixture on a workpiece. The workpiece may comprise a hollowed structure such as a rocket or jet engine combustion chamber liner. The method comprises providing a magnetron and an external sputter target material comprising chromium or a copper-chromium composite and effecting a magnetron sputter deposition to deposit a substantially uniform nanostructured coating comprising said sputter target material on said workpiece. The method may include plasma enhancement wherein a filament is utilized to produce a plasma that effects an ion bombardment on the workpiece during the magnetron sputter deposition process. The invention also includes the nanostructured coatings deposited by these methods and workpieces coated thereby.
Public/Granted literature
- US20060251917A1 Method for magnetron sputter deposition Public/Granted day:2006-11-09
Information query
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