Invention Grant
- Patent Title: Light emitting device and method of manufacturing the same
- Patent Title (中): 发光元件及其制造方法
-
Application No.: US11506837Application Date: 2006-08-21
-
Publication No.: US07790486B2Publication Date: 2010-09-07
- Inventor: Joon-seop Kwak , Jae-hee Cho
- Applicant: Joon-seop Kwak , Jae-hee Cho
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: KR10-2003-0065219 20030919
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Provided is a light emitting device and a method of manufacturing the same. The light emitting device comprises a transparent substrate, an n-type compound semiconductor layer formed on the transparent substrate, an active layer, a p-type compound semiconductor layer, and a p-type electrode sequentially formed on a first region of the n-type compound semiconductor layer, and an n-type electrode formed on a second region separated from the first region of the n-type compound semiconductor layer, wherein the p-type electrode comprises first and second electrodes, each electrode having different resistance and reflectance.
Public/Granted literature
- US20060281209A1 Light emitting device and method of manufacturing the same Public/Granted day:2006-12-14
Information query
IPC分类: