Invention Grant
US07790499B2 Observation apparatus and method for observing void in underfill resin
有权
用于观察底部填充树脂中的空隙的观察装置和方法
- Patent Title: Observation apparatus and method for observing void in underfill resin
- Patent Title (中): 用于观察底部填充树脂中的空隙的观察装置和方法
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Application No.: US11877051Application Date: 2007-10-23
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Publication No.: US07790499B2Publication Date: 2010-09-07
- Inventor: Masahiko Sato , Kazuyuki Ikura , Toru Nishino
- Applicant: Masahiko Sato , Kazuyuki Ikura , Toru Nishino
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-030423 20070209
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.
Public/Granted literature
- US20080194047A1 OBSERVATION APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2008-08-14
Information query
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