Invention Grant
- Patent Title: Molded leadframe substrate semiconductor package
- Patent Title (中): 成型引线框架基板半导体封装
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Application No.: US12287174Application Date: 2008-10-06
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Publication No.: US07790512B1Publication Date: 2010-09-07
- Inventor: Saravuth Sirinorakul , Somchai Nondhasitthichai
- Applicant: Saravuth Sirinorakul , Somchai Nondhasitthichai
- Applicant Address: TH Bangkok
- Assignee: UTAC Thai Limited
- Current Assignee: UTAC Thai Limited
- Current Assignee Address: TH Bangkok
- Agency: Haverstock & Owens LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A process for forming semiconductor packages comprises partially etching a leadframe matrix, encapsulating it with mold compound, placing a semiconductor die in a leadframe unit and singulating the leadframe matrix. A system for forming semiconductor packages comprises means for partially etching a leadframe matrix, means for encapsulating it with mold compound, means for placing a semiconductor die in a leadframe unit and means for singulating the leadframe matrix.
Information query
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