Invention Grant
- Patent Title: Trench transistor and method for fabricating a trench transistor
- Patent Title (中): 沟槽晶体管和制造沟槽晶体管的方法
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Application No.: US12186242Application Date: 2008-08-05
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Publication No.: US07790550B2Publication Date: 2010-09-07
- Inventor: Franz Hirler , Martin Poelzl , Markus Zundel , Rudolf Zelsacher
- Applicant: Franz Hirler , Martin Poelzl , Markus Zundel , Rudolf Zelsacher
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102005041256 20050831
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A trench transistor having a semiconductor body, in which a trench structure and an electrode structure embedded in the trench structure is disclosed. The electrode structure is electrically insulated from the semiconductor body by an insulation structure. The electrode structure has a gate electrode structure and a field electrode structure arranged below the gate electrode structure and electrically insulated from the latter. There is provided between the gate electrode structure and the field electrode structure a shielding structure for reducing the capacitive coupling between the gate electrode structure and the field electrode structure.
Public/Granted literature
- US20090206401A1 TRENCH TRANSISTOR AND METHOD FOR FABRICATING A TRENCH TRANSISTOR Public/Granted day:2009-08-20
Information query
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