Invention Grant
US07790551B2 Method for fabricating a transistor having a recess gate structure
失效
一种制造具有凹槽栅结构的晶体管的方法
- Patent Title: Method for fabricating a transistor having a recess gate structure
- Patent Title (中): 一种制造具有凹槽栅结构的晶体管的方法
-
Application No.: US12603906Application Date: 2009-10-22
-
Publication No.: US07790551B2Publication Date: 2010-09-07
- Inventor: Kyoung Bong Rouh , Seung Woo Jin , Min Yong Lee , Yong Soo Jung
- Applicant: Kyoung Bong Rouh , Seung Woo Jin , Min Yong Lee , Yong Soo Jung
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR2005-113730 20051125
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A transistor having a recess gate structure and a method for fabricating the same. The transistor includes a gate insulating layer formed on the inner walls of first trenches formed in a semiconductor substrate; a gate conductive layer formed on the gate insulating layer for partially filling the first trenches; gate electrodes formed on the gate conductive layer for completely filling the first trenches, and surrounded by the gate conductive layer; channel regions formed in the semiconductor substrate along the first trenches; and source/drain regions formed in a shallow portion of the semiconductor substrate.
Public/Granted literature
- US20100041196A1 Method for Fabricating a Transistor having a Recess Gate Structure Public/Granted day:2010-02-18
Information query
IPC分类: