Invention Grant
- Patent Title: Method of manufacturing silicon carbide semiconductor device
- Patent Title (中): 制造碳化硅半导体器件的方法
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Application No.: US12177131Application Date: 2008-07-21
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Publication No.: US07790557B2Publication Date: 2010-09-07
- Inventor: Takashi Tsuji
- Applicant: Takashi Tsuji
- Applicant Address: JP
- Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2004-018675 20040127
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Stress is exerted to the SiC crystal in the region, in which the carriers of a SiC semiconductor device flow, to change the crystal lattice intervals of the SiC crystal. Since the degeneration of the conduction bands in the bottoms thereof is dissolved, since the inter-band scattering is prevented from causing, and since the effective electron mass is reduced due to the crystal lattice interval change, the carrier mobility in the SiC crystal is improved, the resistance of the SiC crystal is reduced and, therefore, the on-resistance of the SiC semiconductor device is reduced.
Public/Granted literature
- US20080280412A1 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2008-11-13
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