Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US10512491Application Date: 2003-05-07
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Publication No.: US07790782B2Publication Date: 2010-09-07
- Inventor: Noritaka Sato , Tsutomu Noguchi , Hiroyuki Mori
- Applicant: Noritaka Sato , Tsutomu Noguchi , Hiroyuki Mori
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JP2002-134253 20020509
- International Application: PCT/JP03/05697 WO 20030507
- International Announcement: WO03/095556 WO 20031120
- Main IPC: C08L67/00
- IPC: C08L67/00 ; H02B1/00

Abstract:
A resin composition for molding, added with a nucleating agent suitable for promoting crystallization of a polyester capable of having a crystal structure, and in particular of a biodegradable polyester, and a molded product containing, the resin composition for molding thus improved in the crystallinity has either a cyclic compound expressed by general formula (I): (where each of A1, A2, A4 and A5 commonly or independently expresses —CO— or —NH—, each of A3 and A6 commonly or independently expresses hydrogen, halogen, optionally-substituted aliphatic group or optionally-substituted aromatic group) and having both of —CO— and —NH— in the molecule, or a mixture of (i) a cyclic compound having —CO— but no NH in the molecule and (ii) a cyclic compound having no —CO— but NH in the molecule, together with the polyester capable of having a crystal structure.
Public/Granted literature
- US20060106130A1 Resin composition Public/Granted day:2006-05-18
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