Invention Grant
- Patent Title: Matt polymerization glue
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Application No.: US10503941Application Date: 2003-11-21
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Publication No.: US07790797B2Publication Date: 2010-09-07
- Inventor: Michael Blumenschein , Carlo Schuetz , Xenia Dann , Roland Saettler
- Applicant: Michael Blumenschein , Carlo Schuetz , Xenia Dann , Roland Saettler
- Applicant Address: DE Darmstadt
- Assignee: Evonik Rohm GmbH
- Current Assignee: Evonik Rohm GmbH
- Current Assignee Address: DE Darmstadt
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE10302416 20030121
- International Application: PCT/EP03/13058 WO 20031121
- International Announcement: WO2004/065519 WO 20040805
- Main IPC: B60C1/00
- IPC: B60C1/00 ; C08K7/00

Abstract:
The adhesive bonding of matted PMMA with customary polymerization adhesives leads to very shiny bond seams, since the cured polymerization adhesives have a shiny surface. This emphasizes the very joining zones which it is intended that the viewer of bonded products should not perceive. The adhesive should therefore be matted after curing. The adhesive has for its basis a polymerization adhesive, preferably a (meth)acrylate-based adhesive. Two different kinds of silica are added as disperse powder to the polymerization adhesive, namely a silica powder having an average particle size of from 1 μm to 10 μm (matting agent) and a silica powder having an average particle size of more than 10 μm up to 200 μm (texturing agent).
Public/Granted literature
- US20050124731A1 Matt polymerization glue Public/Granted day:2005-06-09
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