中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US07790828B2 Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage 有权
聚酰亚胺/二氧化硅复合材料的前体溶液，其制造方法和具有低体积收缩率的聚酰亚胺/二氧化硅复合材料

Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage
Abstract:
A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)(4−x) to allow the silica moiety to carry a photo-polymerizable unsaturated group; and adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9, and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.
Abstract(Chinese):

一种制备聚酰亚胺/二氧化硅复合材料的前体溶液的方法和在基材上形成聚酰亚胺/二氧化硅复合材料膜的方法，包括加入硅烷化合物的单体以使聚（酰胺酸）携带二氧化硅部分 ; 加入式（R6）xSi（R7）（4-x）的单体，使二氧化硅部分携带可光聚合的不饱和基团; 并加入式R8N（R9）2的单体以使聚酰胺酸携带可光聚合的不饱和基团，其中R6，R7，R8，R9和x如说明书中所定义。 另外，聚酰亚胺/二氧化硅复合材料的前体溶液和聚酰亚胺/二氧化硅复合材料。 复合材料可用于微电子器件，半导体元件和光电元件。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0