Invention Grant
- Patent Title: Device for repair of a contact pad of a printed circuit board
- Patent Title (中): 用于修复印刷电路板的接触垫的装置
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Application No.: US12136308Application Date: 2008-06-10
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Publication No.: US07790985B2Publication Date: 2010-09-07
- Inventor: Joseph P. Palmeri , Vincent P. Mulligan
- Applicant: Joseph P. Palmeri , Vincent P. Mulligan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Stephen Bongini
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stem and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.
Public/Granted literature
- US20080251289A1 DEVICE FOR REPAIR OF A CONTACT PAD OF A PRINTED CIRCUIT BOARD Public/Granted day:2008-10-16
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