Invention Grant
- Patent Title: Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus
- Patent Title (中): 自动聚焦装置，激光加工装置和激光切割装置
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Application No.: US11280886Application Date: 2005-11-15
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Publication No.: US07791001B2Publication Date: 2010-09-07
- Inventor: Masayuki Nishiwaki , Junichiro Iri , Genji Inada , Sadayuki Sugama
- Applicant: Masayuki Nishiwaki , Junichiro Iri , Genji Inada , Sadayuki Sugama
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A.., Inc., IP Division
- Priority: JP2004-335396 20041119
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/04
Abstract:
At least one exemplary embodiment is directed to a laser processing apparatus that can use the shape of a plurality of reflected light fluxes to adjust the position of workpiece relative to an optical system, where the laser processing apparatus facilitates both the viewing of the workpiece and a focusing of a processing laser into the workpiece.
Public/Granted literature
- US20060109757A1 Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus Public/Granted day:2006-05-25
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