Package with overlapping devices

Invention Grant

US07791084B2 Package with overlapping devices 有权

Title translation: 包装重叠设备

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Patent Title: Package with overlapping devices
Patent Title (中): 包装重叠设备
Application No.: US11971512

Application Date: 2008-01-09
Publication No.: US07791084B2

Publication Date: 2010-09-07
Inventor: Yong Liu , Yumin Liu
Applicant: Yong Liu , Yumin Liu
Applicant Address: US ME South Portland
Assignee: Fairchild Semiconductor Corporation
Current Assignee: Fairchild Semiconductor Corporation
Current Assignee Address: US ME South Portland
Agency: Townsend and Townsend and Crew LLP
Main IPC: H01L31/16
IPC: H01L31/16

Abstract:

A die package is disclosed. The die package includes a substrate, a first device attached to the substrate, and a leadframe structure attached to the substrate. The leadframe structure includes a portion disposed over the first device, and a second device is attached to the first portion of the leadframe structure.

Abstract(Chinese):

公开了一种模具包装。模具封装包括基板，附接到基板的第一装置和附接到基板的引线框架结构。引线框架结构包括设置在第一设备上的部分，并且第二设备附接到引线框架结构的第一部分。

Public/Granted literature

US20090173953A1 PACKAGE WITH OVERLAPPING DEVICES Public/Granted day:2009-07-09

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L31/00	对红外辐射、光、较短波长的电磁辐射，或微粒辐射敏感的，并且专门适用于把这样的辐射能转换为电能的，或者专门适用于通过这样的辐射进行电能控制的半导体器件；专门适用于制造或处理这些半导体器件或其部件的方法或设备；其零部件（H01L51/42优先；由形成在一共用衬底内或其上的多个固态组件，而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00）
H01L31/12	.与如在一个共用衬底内或其上形成的，一个或多个电光源，如场致发光光源在结构上相连的，并与其电光源在电气上或光学上相耦合的（场致发光光源本身入H05B33/00）
H01L31/16	..由单光源或多光源控制的对辐射敏感的半导体器件