A semiconductor device has a plurality of fuse element portions each of which including a first fuse interconnect having a fuse to be portion, a second fuse interconnect connected to an internal circuit, a first impurity diffusion layer for electrically connecting the first fuse interconnect and the second fuse interconnect, and a second impurity diffusion layers. The first fuse interconnect, the second fuse interconnect, and the first impurity diffusion layer of each of the plurality of fuse element portions are arranged approximately parallel to one another at a predetermined pitch distance.