A manufacturing method of a circuit device that is formed by embedding a circuit in an insulating film is provided, the method including pressure bonding by a vacuum adhesion method on a first film a film that contains an insulating film between elements and is provided with a recess or a penetrated portion to adhere a second film 160 that constitutes a recess 190; embedding a pasty material of an element constituent member inside of the recess 190 by squeegeeing means such as a squeegee; and applying treatment such as drying to the material to form embedding members such as a high resistance member that becomes a resistor 180 and a high dielectric constant member 170 that constitutes a capacitor.