Invention Grant
- Patent Title: Semiconductor device and method of producing the same including a charge accumulation layer with differing charge trap surface density
- Patent Title (中): 半导体装置及其制造方法,包括具有不同电荷陷阱表面密度的电荷累积层
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Application No.: US12162224Application Date: 2007-01-18
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Publication No.: US07791129B2Publication Date: 2010-09-07
- Inventor: Masayuki Terai
- Applicant: Masayuki Terai
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-015866 20060125
- International Application: PCT/JP2007/050688 WO 20070118
- International Announcement: WO2007/086304 WO 20070802
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/336 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
There is provided a trap memory device suppresses electric charges from flowing from the outside into a charge accumulation region and accumulated electric charges from diffusing to the outside or flowing out due to a defect. A gate conductor 6 is formed through a laminate insulating film including a first gate insulating film 3, a charge accumulation layer 4 and a second gate insulating film 5 on a silicon substrate 1. The laminate insulating film (3 to 5) projects outside the gate conductor 6 and extends to under the outer end of a side wall 8. The charge accumulation layer 4 includes a high trap surface-density region 4a immediately under the gate conductor and a low trap surface-density region 4b outside the gate conductor.
Public/Granted literature
- US20090050983A1 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME Public/Granted day:2009-02-26
Information query
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