Invention Grant
US07791129B2 Semiconductor device and method of producing the same including a charge accumulation layer with differing charge trap surface density 有权
半导体装置及其制造方法,包括具有不同电荷陷阱表面密度的电荷累积层

  • Patent Title: Semiconductor device and method of producing the same including a charge accumulation layer with differing charge trap surface density
  • Patent Title (中): 半导体装置及其制造方法,包括具有不同电荷陷阱表面密度的电荷累积层
  • Application No.: US12162224
    Application Date: 2007-01-18
  • Publication No.: US07791129B2
    Publication Date: 2010-09-07
  • Inventor: Masayuki Terai
  • Applicant: Masayuki Terai
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2006-015866 20060125
  • International Application: PCT/JP2007/050688 WO 20070118
  • International Announcement: WO2007/086304 WO 20070802
  • Main IPC: H01L21/8238
  • IPC: H01L21/8238 H01L21/336 H01L29/76 H01L29/94 H01L31/062 H01L31/113 H01L31/119
Semiconductor device and method of producing the same including a charge accumulation layer with differing charge trap surface density
Abstract:
There is provided a trap memory device suppresses electric charges from flowing from the outside into a charge accumulation region and accumulated electric charges from diffusing to the outside or flowing out due to a defect. A gate conductor 6 is formed through a laminate insulating film including a first gate insulating film 3, a charge accumulation layer 4 and a second gate insulating film 5 on a silicon substrate 1. The laminate insulating film (3 to 5) projects outside the gate conductor 6 and extends to under the outer end of a side wall 8. The charge accumulation layer 4 includes a high trap surface-density region 4a immediately under the gate conductor and a low trap surface-density region 4b outside the gate conductor.
Public/Granted literature
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理;集成电路器件或其特殊部件的制造(由预制电组件组成的组装件的制造入H05K3/00,H05K13/00)
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理(电可编程只读存储器或其多步骤的制造方法入H01L27/115)
H01L21/78 ...把衬底连续地分成多个独立的器件(改变表面物理特性或者半导体形状的切割入H01L21/304)
H01L21/82 ....制造器件,例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的(H01L21/8258优先)
H01L21/8232 ......场效应工艺
H01L21/8234 .......MIS工艺
H01L21/8238 ........互补场效应晶体管,例如CMOS
Patent Agency Ranking
0/0