Invention Grant
- Patent Title: Inductively coupled integrated circuit and methods for use therewith
- Patent Title (中): 电感耦合集成电路及其使用方法
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Application No.: US12788451Application Date: 2010-05-27
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Publication No.: US07791167B1Publication Date: 2010-09-07
- Inventor: Ahmadreza (Reza) Rofougaran
- Applicant: Ahmadreza (Reza) Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick Harrison & Markison
- Agent Bruce E. Stuckman
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/58
Abstract:
A circuit includes a first integrated circuit or die having a first circuit and a first inductive interface. A second integrated circuit or die has a second circuit and a second inductive interface. The first inductive interface and the second inductive interface are aligned to magnetically communicate signals between the first circuit and the second circuit.
Public/Granted literature
- US20100230785A1 INDUCTIVELY COUPLED INTEGRATED CIRCUIT AND METHODS FOR USE THEREWITH Public/Granted day:2010-09-16
Information query
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