Invention Grant
US07791173B2 Chip having side pad, method of fabricating the same and package using the same
有权
具有侧垫的芯片，其制造方法及使用其的封装
- Patent Title: Chip having side pad, method of fabricating the same and package using the same
- Patent Title (中): 具有侧垫的芯片，其制造方法及使用其的封装
-
Application No.: US11858095Application Date: 2007-09-19
-
Publication No.: US07791173B2Publication Date: 2010-09-07
- Inventor: Jiyong Park
- Applicant: Jiyong Park
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2007-0007254 20070123; KR10-2007-0032940 20070403
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/48
Abstract:
A semiconductor device includes a first chip having a top surface, a bottom surface and a side surface connected to the top and bottom surfaces. The first chip includes a chip substrate; a lower conductive pattern over the chip substrate; an interlayer dielectric layer over the lower conductive pattern; and an upper conductive pattern over the interlayer dielectric layer. At least a portion of the lower conductive pattern and at least a portion of the upper conductive pattern are exposed on the side surface of the first chip to collectively form a side pad.
Public/Granted literature
- US20080174023A1 CHIP HAVING SIDE PAD, METHOD OF FABRICATING THE SAME AND PACKAGE USING THE SAME Public/Granted day:2008-07-24
Information query
IPC分类:
