Invention Grant
US07791185B2 Pin grid array package substrate including pins having curved pin heads
有权
引脚格栅阵列封装衬底，包括具有弯曲引脚头的引脚
- Patent Title: Pin grid array package substrate including pins having curved pin heads
- Patent Title (中): 引脚格栅阵列封装衬底，包括具有弯曲引脚头的引脚
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Application No.: US11758401Application Date: 2007-06-05
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Publication No.: US07791185B2Publication Date: 2010-09-07
- Inventor: Mengzhi Pang
- Applicant: Mengzhi Pang
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An electrically conductive pin comprising a pin stern and a pin head attached to the pin stem. The pin head is adapted to be mounted onto a surface of a microelectronic substrate to support the pin stem. The pin head has an underside surface defining a continuous curve configured to allow gases to escape from a pin-attach solder region adjacent the underside surface.
Public/Granted literature
- US20080303135A1 Pin Grid Array Package Substrate Including Pins Having Curved Pin Heads Public/Granted day:2008-12-11
Information query
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