Invention Grant
US07791193B2 Pad over active circuit system and method with meshed support structure
有权
覆盖有源电路系统和网格支持结构的方法
- Patent Title: Pad over active circuit system and method with meshed support structure
- Patent Title (中): 覆盖有源电路系统和网格支持结构的方法
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Application No.: US11943381Application Date: 2007-11-20
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Publication No.: US07791193B2Publication Date: 2010-09-07
- Inventor: Inderjit Singh , Howard Lee Marks , Joseph David Greco
- Applicant: Inderjit Singh , Howard Lee Marks , Joseph David Greco
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.
Public/Granted literature
- US20080067687A1 PAD OVER ACTIVE CIRCUIT SYSTEM AND METHOD WITH MESHED SUPPORT STRUCTURE Public/Granted day:2008-03-20
Information query
IPC分类:
