Invention Grant
US07791203B2 Interconnects for packaged semiconductor devices and methods for manufacturing such devices
有权
用于封装半导体器件的互连和用于制造这种器件的方法
- Patent Title: Interconnects for packaged semiconductor devices and methods for manufacturing such devices
- Patent Title (中): 用于封装半导体器件的互连和用于制造这种器件的方法
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Application No.: US11848836Application Date: 2007-08-31
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Publication No.: US07791203B2Publication Date: 2010-09-07
- Inventor: Suan Jeung Boon , Yong Poo Chia , Meow Koon Eng
- Applicant: Suan Jeung Boon , Yong Poo Chia , Meow Koon Eng
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Packaged semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a packaged semiconductor assembly includes a die attached to a support layer. A plurality of interconnects are embedded in and project from the support layer, such that the support layer at least partially retains the interconnects in a predetermined array. An encapsulant is molded around each of the interconnects and encases at least a portion of the die, support layer and interconnects.
Public/Granted literature
- US20090014859A1 INTERCONNECTS FOR PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SUCH DEVICES Public/Granted day:2009-01-15
Information query
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