Invention Grant
- Patent Title: Flip chip package structure and carrier thereof
- Patent Title (中): 倒装芯片封装结构及其载体
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Application No.: US12228683Application Date: 2008-08-15
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Publication No.: US07791211B2Publication Date: 2010-09-07
- Inventor: Jen-Chuan Chen , Chi-Chih Shen , Hui-Shan Chang , Tommy Pan
- Applicant: Jen-Chuan Chen , Chi-Chih Shen , Hui-Shan Chang , Tommy Pan
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: J.C. Patents
- Priority: TW96139335A 20071019
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps.
Public/Granted literature
- US20090102047A1 Flip chip package structure and carrier thereof Public/Granted day:2009-04-23
Information query
IPC分类:
